Semiconductor device



FIG. 1 is a perspective view of a first embodiment of a semiconductor device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a left side elevation view thereof;

FIG. 8 is a perspective view of a second embodiment of a semiconductor device showing our new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a bottom plan view thereof;

FIG. 11 is a front elevation view thereof;

FIG. 12 is a rear elevation view thereof;

FIG. 13 is a right side elevation view thereof; and,

FIG. 14 is a left side elevation view thereof.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design. 

CLAIM We claim the ornamental design for a semiconductor device, as shown and described. 